陳冠能(Chen, Kuan-Neng)

工程四館 506 室
TEL: (03)5712121 ext. 31558
FAX: (03)5724261
Email: knchen@mail.nctu.edu.tw






        Dr. Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). Currently he is Professor of Department of Electronics Engineering and Vice Dean of International College of Semiconductor Technology in National Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.
        Dr. Chen holds NCTU Distinguished Faculty Award since 2011, and received NCTU Outstanding Industry-Academia Cooperation Achievement Award for 4 times, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, EDMA Outstanding Service Award, Adventech Young Professor Award, CIEE Outstanding Youth Engineer Award, and EDMA Outstanding Youth Award. He also received several IBM Awards, including five IBM Invention Plateau Invention Achievement Awards and two Awards from Exploratory Technology Group. Dr. Chen is the editor of the book "3D Integration for VLSI Systems". He has authored more than 270 publications in book chapters, journals and international conferences. He holds 80 patents and has given more than 70 invited talks in industries, research institutes, and universities worldwide. Regarding the service of committee in international conferences, he is program chair of IEEE IITC 2018, co-chairman of IEEE IPFA 2015, and currently is committee member of IEDM, IEEE 3DIC, IEEE IITC, IEEE SSDM, IEEE VLSI-TSA, IMPACT, and DPS. Dr. Chen is a member of Phi Tau Phi Scholastic Honor Society and IEEE Fellow.
        In addition to his faculty position, Dr. Chen is currently Joint-Appointment R&D Director of Industrial Technology and Research Institute (ITRI). He was the Deputy Director of ASE-NCTU R&D Center, Adjunct Research Staff Member at National Chip Implementation Center (CIC), and Guest Editor of MRS Bulletin. Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), heterogeneous integration, and advanced packaging technology.