陳冠能(Chen, Kuan-Neng)

工程四館 506 室
TEL: (03)5712121 ext. 31558
FAX: (03)5724261
Email: knchen@mail.nctu.edu.tw






        Dr. Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). Currently he is Professor of Department of Electronics Engineering and Associate Dean of International College of Semiconductor Technology in National Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.
        Dr. Chen receives NCTU Distinguished Faculty Award every year since 2011, three NCTU Outstanding Industry-Academia Cooperation Achievement Awards, CIEE Outstanding Professor Award, EDMA Outstanding Service Award, Adventech Young Professor Award, CIEE Outstanding Youth Engineer Award, and EDMA Outstanding Youth Award. He also holds several IBM Awards, including five IBM Invention Plateau Invention Achievement Awards and two Awards from Exploratory Technology Group. Dr. Chen is the editor of the book "3D Integration for VLSI Systems". He has authored 267 publications in book chapters, journals and international conferences. He holds 77 patents and has given more than 77 invited talks in industries, research institutes, and universities worldwide. He served the co-chairman of technical program committee of IEEE IPFA 2015, and currently is committee member of IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, IMPACT, IMAPS 3D Packaging, and DPS. Dr. Chen is a member of Phi Tau Phi Scholastic Honor Society and Senior Member of the IEEE.
        In addition to his faculty position, Dr. Chen is currently Consultant of Industrial Technology and Research Institute (ITRI). He was Adjunct Research Staff Member at National Chip Implementation Center (CIC), Deputy Director of ASE-NCTU R&D Center, and Guest Editor of MRS Bulletin. Dr. Chen starts three-dimensional integrated circuits (3D IC) research since 2000. His current research interests are three-dimensional integrated circuits (3D IC), heterogeneous integration, and advanced packaging technology.